Die Bonding and Vacuum Packaging System


Subject: Die Bonding and Vacuum Packaging System
Solicitation Number: N0017326QKN05
Notice Type: SOLICIT
NAICS: 333993
Notice Published: 08-03-26
Response Due: 08-07-26

Agency: Department of the Navy
Office: NAVAL RESEARCH LABORATORY
Contact: KEVIN NGUYEN This email address is being protected from spambots. You need JavaScript enabled to view it.
Office Address: WASHINGTON, DC 20375-5328
Place of Performance: DC 20375

Related Notices:
        07-23-26 SOLICIT


Click for official SAM (FBO) notice, additional information, and accompanying attachments

Please see attached combined synopsis/solicitation